Features
- 0.4mm pitch for large array
- Compression surface mount
- Support up to 34×34 ball matrix
- Z-axis compliant buckling beam, contact provides stable contact performance independent or solder ball height and composition
- Sharpe edge of dual-point contact tip provides high electrical performance, minimizing ball damage
- Staggered fan out footprint for PCB design consideration
- Advanced latching system provide the ability to handle very thin package, limiting package wrap