Any Semiconductor Interconnect with Fast Delivery

BEI Sensors/Sensata 676 Series TSSOP Devices Dual Pinch ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, zero insertion force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion Thru hole

BEI Sensors/Sensata 678 Series

Electrotechnical equipment, Semiconductor Interconnect

Features “Dual Pinch” highly reliable contacts Separate contacts for interfacing with heat slug Open top, zero insertion force for automatic

BEI Sensors/Sensata 680 Series QFP Devices Dual Pinch

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam

BEI Sensors/Sensata 70CP

Electrotechnical equipment, Semiconductor Interconnect

The 70CP series pressure sensors are ideally suited for environmentally demanding OEM industrial applications. This series accommodates a wide range

BEI Sensors/Sensata 715 Series CSP/BGA/QFN Devices Open Top

Electrotechnical equipment, Semiconductor Interconnect

Features Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed

BEI Sensors/Sensata 716 Series QFN/LGA Devices Open Top

Electrotechnical equipment, Semiconductor Interconnect

Features Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact

BEI Sensors/Sensata 717 Series QFN/LGA Devices Lidded

Electrotechnical equipment, Semiconductor Interconnect

Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure

BEI Sensors/Sensata 718 Series CSP/BGA/QFN Devices Lidded

Electrotechnical equipment, Semiconductor Interconnect

Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure

BEI Sensors/Sensata 72X Series CSP/BGA/QFN Devices Lidded

Electrotechnical equipment, Semiconductor Interconnect

Features Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for

BEI Sensors/Sensata 772 Series CSP/FBGA Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.4mm pitch for large array Compression surface mount Support up to 34×34 ball matrix Z-axis compliant buckling beam, contact

BEI Sensors/Sensata 773 Series CSP/FBGA Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle

BEI Sensors/Sensata 774 Series CSP/FBGA Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis

BEI Sensors/Sensata 775 Series CSP/FBGA Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.5mm and 0.8mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis

BEI Sensors/Sensata 775E Series CSP/FBGA Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.8mm Pitch Compression surface mount Z-axis compliant “U” shaped contact supports a wide variety of solder ball shape and

BEI Sensors/Sensata 776 Series CSP/FBGA Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.5mm and 0.65mm pitch Low cost / high performance achieved through use of carrier loaded stamped contact “U” contact

BEI Sensors/Sensata 776P Series CSP/BGA/QFN Devices Open Top

Electrotechnical equipment, Semiconductor Interconnect

Features Smallest Open Top QFN Socket outline in the industry Thru hole design Robust design built for auto-loading Proven contact

BEI Sensors/Sensata 777 Series CSP Devices

Electrotechnical equipment, Semiconductor Interconnect

Features Open top chip scale package and fine pitch BGA’s Accommodates pitch sizes of 0.65mm, 0.75mm, and 0.8mm Compact size

BEI Sensors/Sensata 790 Series QFN Devices

Electrotechnical equipment, Semiconductor Interconnect

Features 0.4mm, 0.5mm, 0.65mm, and 8mm pitch Low cost design using stamped cantilever contact Staggered, through hole tail design for

BEI Sensors/Sensata 860 Series CSP/BGA/QFN Devices

Electrotechnical equipment, Semiconductor Interconnect

Features Versatile, low cost socket base Passive heat sink or Heat Sink/Heater/Sensor Replaceable contact set Heater – foil or cartridge