Any Semiconductor Interconnect with Fast Delivery

BEI Sensors/Sensata 6024 Series Combosense™ Temperature Sensor & Thermostat Probe

Electrotechnical equipment, Semiconductor Interconnect

The Airpax™ 6024 thermal sensor-switch offers the function and reliability of a grounded case snap-action thermostat with the sensing capability

BEI Sensors/Sensata 60CP Ceramic Capacitive Pressure Sensor

Electrotechnical equipment, Semiconductor Interconnect

The 60CP series pressure sensors are ideally suited for environmentally demanding industrial applications. Using a 5.0 V excitation input, the

BEI Sensors/Sensata 611 Series TO Pin Circle Devices

Electrotechnical equipment, Semiconductor Interconnect

Features Molded guides prevent “stubbing” of device leads Low-insertion force contacts with large target area Retention Feature on the tails

BEI Sensors/Sensata 612 Series TO Pin Circle Devices

Electrotechnical equipment, Semiconductor Interconnect

Features Low-insertion force Large entry area for easy insertion of device leads Polarized to BIB, not to device Four solder

BEI Sensors/Sensata 613 Series Dual In-line Packages (DIP)

Electrotechnical equipment, Semiconductor Interconnect

Features Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe

BEI Sensors/Sensata 619 Series Penultimate Contactor for 2’x2’ Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Mechanical Advantage Latch provides easy operation Preloaded high normal force contacts on .025″ and .050″ centers Teflon® coated base

BEI Sensors/Sensata 621 Series Compact Version .030″ Pitch FlatPack Contactor for ¾” x 1” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features 20, 22, 24 and 28-lead contractors on .030″ centers Easy insertion of device leads For temperatures up to 150°C

BEI Sensors/Sensata 621 Series Standard Version .050″ Pitch FlatPack Contactor for ¾” x 1” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Standard 30 microinches of select gold plating over 50 microinches of nickel Easy-to-operate Latch stop prevents shorting if carrier

BEI Sensors/Sensata 625 Series Quad Pack Contactor for 2”x2” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Low profile… less than .780″ off printed circuit board Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive, stainless

BEI Sensors/Sensata 626 Series FlatPack Contactor for 2”x2” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Stainless steel latch with long-lasting metal latch and hinge pins Beryllium Copper Allow contacts plated with 30 microinches of

BEI Sensors/Sensata 628 Series FlatPack Contactor for 1 ¼”x 1 ¼” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive,

BEI Sensors/Sensata 629 Series Quad Pack Contactor for 1 ¼”x 1 ¼” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features One-piece, non-corrosive stainless steel latch Easy loading of carrier and IC device Beryllium Copper contacts plated with 30 microinches

BEI Sensors/Sensata 646 Series FlatPack Contactor for 1 ¼”x 1 ¼” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Latch features manual/automatic release Beryllium Copper stamped contacts plated with 30 microinches of gold 28, 32, 36, 48, and

BEI Sensors/Sensata 647 Series PLCC Devices

Electrotechnical equipment, Semiconductor Interconnect

Features Direct entry with zero insertion force Series 647A dead bug device insertion Series 647C live bug device insertion Heat

BEI Sensors/Sensata 652 Series SOP Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts

BEI Sensors/Sensata 652D Series Dual Beam SOP Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, Zero Insertion Force design for automatic loading Compact size for high board density Two points of contact

BEI Sensors/Sensata 656 Series SSOP Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts

BEI Sensors/Sensata 656T Series SSOP with Center Pad Connection Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe

BEI Sensors/Sensata 6600 Series 8 Pin Dip Style Subminiature Thermostat

Electrotechnical equipment, Semiconductor Interconnect

The Airpax® 6600 series is a RoHS compliant, positive snap action, single pole / single throw, a subminiature bimetallic thermostat

BEI Sensors/Sensata 6700 Series TO-220 Subminiature Thermostat

Electrotechnical equipment, Semiconductor Interconnect

The Airpax® 6700 series is a RoHS compliant, positive snap action, single pole / single throw, a subminiature bimetallic thermostat