Any Electrotechnical equipment with Fast Delivery

BEI Sensors/Sensata 628 Series FlatPack Contactor for 1 ¼”x 1 ¼” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Beryllium Copper contacts plated with 30 microinches of select gold Latch hold-down prevents carrier bowing at elevated temperatures Non-corrosive,

BEI Sensors/Sensata 629 Series Quad Pack Contactor for 1 ¼”x 1 ¼” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features One-piece, non-corrosive stainless steel latch Easy loading of carrier and IC device Beryllium Copper contacts plated with 30 microinches

BEI Sensors/Sensata 646 Series FlatPack Contactor for 1 ¼”x 1 ¼” Carrier

Electrotechnical equipment, Semiconductor Interconnect

Features Latch features manual/automatic release Beryllium Copper stamped contacts plated with 30 microinches of gold 28, 32, 36, 48, and

BEI Sensors/Sensata 647 Series PLCC Devices

Electrotechnical equipment, Semiconductor Interconnect

Features Direct entry with zero insertion force Series 647A dead bug device insertion Series 647C live bug device insertion Heat

BEI Sensors/Sensata 652 Series SOP Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts

BEI Sensors/Sensata 652D Series Dual Beam SOP Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, Zero Insertion Force design for automatic loading Compact size for high board density Two points of contact

BEI Sensors/Sensata 656 Series SSOP Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, zero insertion force design for automatic loading Compact size for high board density Highly reliable, pre-loaded contacts

BEI Sensors/Sensata 656T Series SSOP with Center Pad Connection Devices ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Compact size for maximum board density Wide target area for easy entry and removal of IC leads Dual face-wipe

BEI Sensors/Sensata 6600 Series 8 Pin Dip Style Subminiature Thermostat

Electrotechnical equipment, Semiconductor Interconnect

The Airpax® 6600 series is a RoHS compliant, positive snap action, single pole / single throw, a subminiature bimetallic thermostat

BEI Sensors/Sensata 6700 Series TO-220 Subminiature Thermostat

Electrotechnical equipment, Semiconductor Interconnect

The Airpax® 6700 series is a RoHS compliant, positive snap action, single pole / single throw, a subminiature bimetallic thermostat

BEI Sensors/Sensata 676 Series TSSOP Devices Dual Pinch ZIF

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, zero insertion force design for automatic loading Dual pinch, highly reliable contacts Live bug insertion Thru hole

BEI Sensors/Sensata 678 Series

Electrotechnical equipment, Semiconductor Interconnect

Features “Dual Pinch” highly reliable contacts Separate contacts for interfacing with heat slug Open top, zero insertion force for automatic

BEI Sensors/Sensata 680 Series QFP Devices Dual Pinch

Electrotechnical equipment, Semiconductor Interconnect

Features Open top, Zero Insertion Force design for automatic loading Compact outline for maximum board density Highly reliable Dual Beam

BEI Sensors/Sensata 6AP Motor Protector

Electrotechnical equipment, Auto DC Motor Protectors

As a world leader in automotive motor protection, Sensata Technologies has developed the KLIXON® 6AP to operate in wide temperature and

BEI Sensors/Sensata 70CP

Electrotechnical equipment, Semiconductor Interconnect

The 70CP series pressure sensors are ideally suited for environmentally demanding OEM industrial applications. This series accommodates a wide range

BEI Sensors/Sensata 715 Series CSP/BGA/QFN Devices Open Top

Electrotechnical equipment, Semiconductor Interconnect

Features Open top Compression surface mount Spring and probe contact 4 point crown tip interface on DUT solder ball Pointed

BEI Sensors/Sensata 716 Series QFN/LGA Devices Open Top

Electrotechnical equipment, Semiconductor Interconnect

Features Open Top Compression Surface Mount Spring and probe contact Pointed probe contacts DUT pad Pointed probe maintains continuous contact

BEI Sensors/Sensata 717 Series QFN/LGA Devices Lidded

Electrotechnical equipment, Semiconductor Interconnect

Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure

BEI Sensors/Sensata 718 Series CSP/BGA/QFN Devices Lidded

Electrotechnical equipment, Semiconductor Interconnect

Features Clamshell design, compression surface mount Spring and probe contact Pointed probe maintains continuous contact to PCB Spring loaded pressure

BEI Sensors/Sensata 72X Series CSP/BGA/QFN Devices Lidded

Electrotechnical equipment, Semiconductor Interconnect

Features Handles package sizes 3x3mm to 10x10mm Clam shell Compression Surface Mount Elastomer interface material Wedge guided pressure pad for